Dr. Andreas Ostmann heads the System Integration and Interconnect Technologies department at Fraunhofer IZM. For more than 25 years, he and his working group have been dedicated to embedding electronic components in printed circuit boards. The technologies they have developed are now used worldwide, including processes for chemical metallization of flip chip dies. He studied applied semiconductor physics at the Technical University of Berlin and completed his doctorate in microsystems technology.
3D-Printing 5G 6G Al Cu bonding wires Antenna Artificial Intelligence Autonomous Driving Bioelectronics Bump Bonding Camera Chiplets Circular Design Circular Economy Cost Model Cybersecurity Data Centers Digital Twin e-textiles & smart textiles Eco-Design of Electronic Products Electronic Packaging Embedding Energy Harvesting Energy Labels European Green Deal Flip-Chip Grey-Box-Modeling Hackathon Hearables Heterogeneous Integration High Performance Computing ICT Implants Industry 4.0 Intelligent Textiles Internet of Things Laser Welding LED Life Cycle Assessment of Electronics Location tracking Low Power Machine Learning Material Analysis Medicine Modular Electronics Panel-Level Packaging Photonic Integration Power Electronics Quantum Technology Radar Reliability of Electronic Systems Science Communication Semiconductors Sensor Systems Smart Farming Sustainable electronics System-in-Package (SiP) System-on-Chip (SoC) Wafer Level Packaging Wire bonding Wireless Communication
